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Laser Ablation Equipment Product List

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Laser Ablation Device "LASER BLENDER"

Laser Ablation Device "LASER BLENDER"

Precise measurement of micro-areas on the sample surface! High-speed analysis using a galvanometer mirror.

The "LASER BLENDER" is a laser ablation device that achieves high-speed and high-precision LA-ICP analysis. It enables direct approaches to solid samples, allowing for "local," "imaging," and "depth" analysis. It not only simplifies the preprocessing for ICP analysis but also expands the range of analytical methods, including direct solid analysis, high-speed analysis, and local analysis. 【Features】 ■ Reduces thermal effects and refines generated particles for high precision using FHG f's laser ■ High-speed ablation with a galvanometer scanner ■ Enables high spatial resolution measurements with a minimum focal diameter of 1μmΦ ■ Equipped with a goniometer to correct sample tilt ■ Arbitrary setting of ablation shapes using a tablet device *For more details, please refer to the related links or feel free to contact us. Exhibition Participation JASIS 2023 Advanced Science and Analytical Systems & Solutions Exhibition Date: September 6-8, 2023, 10:00 AM - 5:00 PM Venue: Makuhari Messe International Exhibition Hall, 2-1 Nakase, Mihama-ku, Chiba City, Chiba Prefecture 261-0023 Booth: 4B-206

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  • Analytical Equipment and Devices
  • Laser Ablation Equipment

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Laser processing equipment for semiconductors "LASER BLENDER"

Laser processing equipment for semiconductors "LASER BLENDER"

Analyze by grinding without dissolving the sample. Improve the analysis accuracy of microfabrication.

In the semiconductor industry, detailed compositional analysis of materials is essential due to the increasing performance requirements of products. Particularly in the quality control of wafers and thin films, localized component analysis and depth profiling are necessary. Traditional analytical methods often involve lengthy sample preparation and have limitations in analytical precision. The laser ablation device 'LASER BLENDER' achieves high-speed and high-precision LA-ICP analysis, addressing the challenges of analysis in semiconductor manufacturing. 【Usage Scenarios】 - Foreign substance analysis of wafers - Depth profiling of thin films - Localized analysis of fine structures 【Benefits of Implementation】 - Reduction in analysis time - Achievement of high-precision analytical results - Diversification of analytical methods

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  • Analytical Equipment and Devices
  • Laser Ablation Equipment

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Medical Laser Ablation Device

Medical Laser Ablation Device

Analyze by grinding without dissolving the sample. Achieve localized, imaging, and depth-direction analysis.

In the field of medical technology, precision machining requires the high-accuracy processing of fine structures and complex shapes. Particularly in the analysis of biological tissues and medical devices, it is crucial to efficiently obtain necessary information while minimizing damage to the samples. Traditional cutting methods have limitations due to tissue degeneration from thermal effects and constraints on processing accuracy. The laser ablation device 'LASER BLENDER' achieves high-speed and high-precision LA-ICP analysis, enabling localized, imaging, and depth-direction analysis through direct approaches to solid samples. This expands the scope of analysis in the medical field and accelerates research and development. 【Application Scenarios】 - Analysis of fine structures in biological tissues - Material analysis of medical devices - Evaluation of drug delivery systems - Depth-direction analysis of pathological tissues 【Benefits of Implementation】 - Detailed information acquisition through high-precision localized analysis - Minimization of thermal effects on samples - Reduction and efficiency improvement of analysis time - Advancement of research through diversification of analytical methods

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  • Analytical Equipment and Devices
  • Laser Ablation Equipment

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Laser Ablation Device for Research Institutions

Laser Ablation Device for Research Institutions

Analyze by grinding without dissolving the sample. Achieve local, imaging, and depth-direction analysis.

In material analysis at research institutions, the analysis of elemental composition and structure in micro-regions of samples is required. Particularly in the evaluation of material properties and the development of new materials, detailed analysis in the depth direction from the surface is important. Conventional analytical methods have limitations in terms of sample damage and analytical precision. The "LASER BLENDER" is a laser ablation device that achieves high-speed and high-precision LA-ICP analysis. It enables direct approaches to solid samples, facilitating "local," "imaging," and "depth" analyses, thereby accelerating research and development. 【Application Scenarios】 - Local analysis of materials - Depth analysis of thin films - Foreign substance analysis - Element mapping 【Benefits of Implementation】 - Reduction in analysis time - High-precision analytical results - Expansion of analytical methods - Reduction of thermal impact on samples

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  • Analytical Equipment and Devices
  • Laser Ablation Equipment

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Laser processing device for automobiles "LASER BLENDER"

Laser processing device for automobiles "LASER BLENDER"

Achieving surface modification of automotive parts in a localized, imaging, and depth direction.

In the automotive industry, surface modification technology is essential for improving the durability of parts and enhancing functionality. In particular, there is a demand for improved wear resistance of metal components and increased efficiency in the pre-treatment process before painting. Conventional surface modification technologies have faced challenges such as limitations in processing range and the complexity of analysis. The laser ablation device "LASER BLENDER" addresses these issues and contributes to the improvement of automotive parts quality. 【Application Scenarios】 - Surface modification of metal components - Pre-treatment before painting - Foreign substance analysis - Depth-direction analysis 【Effects of Implementation】 - High-speed and high-precision LA-ICP analysis - Pinpoint quality evaluation through localized analysis - Expansion of analytical methods - Simplification of the pre-treatment process

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  • Analytical Equipment and Devices
  • Laser Ablation Equipment

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Aerospace Laser Processing Device "LASER BLENDER"

Aerospace Laser Processing Device "LASER BLENDER"

Cutting samples for analysis, contributing to lightweighting in the aerospace field.

In the aerospace industry, reducing the weight of components is essential for improving performance and reducing costs. Material composition analysis plays a crucial role in the development of lightweight new materials. However, traditional analytical methods often take a long time or can destroy the samples. The laser ablation device 'LASER BLENDER' achieves high-speed and high-precision LA-ICP analysis, addressing the challenges of material analysis in the aerospace field. By directly approaching solid samples, it enables localized, imaging, and depth analysis, supporting rapid analysis and material development. [Application Scenarios] - Material analysis of aircraft components - Material analysis of rocket engines - Material analysis of space station components [Effects of Implementation] - Acceleration of material analysis - Improvement in analytical accuracy - Acceleration of new material development

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  • Analytical Equipment and Devices
  • Laser Ablation Equipment

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LASER BLENDER for Fiber Pattern Analysis

LASER BLENDER for Fiber Pattern Analysis

Local analysis of fiber patterns achieved without dissolving the sample.

In the textile industry, detailed analysis of fiber patterns is required for product quality control and research and development. Particularly in the development of new materials and the improvement of existing product quality, it is crucial to accurately understand the fine structure of patterns. Traditional analytical methods have faced challenges such as sample destruction and lengthy analysis times. The LASER BLENDER is a laser ablation device that achieves high-speed and high-precision LA-ICP analysis. It enables direct approaches to solid samples, allowing for "local," "imaging," and "depth" analysis, facilitating detailed analysis of fiber patterns. 【Application Scenarios】 - Quality evaluation of textile products - Development of new materials - Pattern analysis - Foreign substance analysis 【Benefits of Implementation】 - Minimization of impact on samples through non-destructive analysis - Reduction of analysis time through high-speed analysis - Detailed pattern analysis through local analysis - Expansion of the range of analytical methods

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  • Analytical Equipment and Devices
  • Laser Ablation Equipment

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